| 摘要 |
PROBLEM TO BE SOLVED: To obtain an airtight terminal for the press fit encapsulation wherein the terminal is endurable against a high temperature soldering, and wherein the air tightness is secured in addition. SOLUTION: In a press fit face of metallic ring constituting the airtight terminal for press fit encapsulation, a gold-copper alloy having a fusion temperature about 280 deg.C or more is plated, or copper or nickel is plated as an under lay and a gold-tin alloy having a fusion temperature about 280 deg.C or more is plated on it.
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