| 摘要 |
PURPOSE: Provided is a process for producing a bus-bar for electric ion plating, which improves contact force between copper and titanium, therefore, lifetime is extended and the thickness of plating is equalized by controlling the amount of added anode. CONSTITUTION: The process comprises the steps of: a first step(S1) for draw-molding a titanium pipe(1); a second step(S2) for heating and extruding the copper(2) and inserting the copper(2) in the titanium pipe(1); a third step(S3) for rolling the copper(2) inserted titanium pipe(1) by using compressing rollers; a forth step(S4) for bending the titanium pipe(1).
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