发明名称 |
Interleaved signal trace routing |
摘要 |
A multi-layer electronic device package includes first and second outer layers and at least one signal layer disposed between the outer layers. The signal layer includes signal traces and ground traces interleaved with the signal traces. A method of routing signal traces in an electronic device package includes the acts of disposing a plurality of signal traces in at least one substrate layer, and interleaving a plurality of ground traces with the signal traces.
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申请公布号 |
US2001010395(A1) |
申请公布日期 |
2001.08.02 |
申请号 |
US20010805862 |
申请日期 |
2001.03.14 |
申请人 |
BALL ZANE A.;GUTMAN AVIRAM;CLARK LAWRENCE T. |
发明人 |
BALL ZANE A.;GUTMAN AVIRAM;CLARK LAWRENCE T. |
分类号 |
H01L23/498;H05K1/00;H05K1/02;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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