摘要 |
<p>The control device has a cooling module (2) with a metal surface. A cooling medium is passed across the surface, supported centrally within a housing (1). The housing contains a number of function modules (3,4,5,6) with their semiconductor elements (32,42,52,62) mounted on respective carriers (31,41,51,61), coupled to the cooling module via module carriers (33,43,53). The termination rails (71) for the control signals for the function module semiconductors, the function module output signals (R,S,T), or sensor signals, project perpendicularly from the housing.</p> |
申请人 |
TEMIC TELEFUNKEN MICROELECTRONIC GMBH |
发明人 |
BAEUMEL, HERMANN;FLIERL, WERNER;KILIAN, HERMANN;LEICHT, GUENTER;SCHUCH, BERNHARD;SCHUELLER, EHRENFRIED |