| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin for sealing a semiconductor compatible to an insertion mounting and a surface mounting, excellent in normal temperature preserving property, rapid curing property and solder cracking resistance. SOLUTION: This epoxy resin composition is characterized by containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator which is a molecular association compound of (X) a tetra-substituted phosphonium, (Y) a compound having >=2 phenolic hydroxyl groups in 1 molecule with a conjugated base of (Y) are compound having >=2 phenolic hydroxyl groups in 1 molecule, wherein the above conjugated base is a phenoxide compound obtained by removing 1 hydrogen atom from (Y) the compound having >=2 phenolic hydroxyl groups in 1 molecule and (D) an inorganic filler material as essential components, and having a ratio of 1.1-1.4 mole of the epoxy group based on 1 mole of the phenolic hydroxyl group as the ratio the total epoxy resin to the total phenol resin.
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