发明名称 POLISHING DEVICE FOR WAFER
摘要 PROBLEM TO BE SOLVED: To suitably follow fine inclination fluctuation, stably retain a wafer retainer board, and improve the polishing accuracy of the wafer. SOLUTION: A retainer part 10 for retaining the wafer 12 is provided with a head member 20 provided with a recess 21, a wafer retainer board 22 arranged inside the recess 21 and having a retainer face 22a for retaining the wafer, a lower elastic suspension member 24 arranged across the head member 20 and the wafer retainer board 22a by being fixed to the both and positioned on the lower side near the retainer face 22a, an upper elastic suspension member 26 arranged across the head member 20 and the wafer retainer board 2 by being fixed to the both, and positioned on the upper side of the lower elastic suspension member 24, a wafer pressurizing pressure chamber 28 partitioned, at least, one of the lower elastic suspension member 24 or the upper elastic suspension member 26 and formed by sealing, and a pressurizing means 30 for feeding the pressure fluid to the wafer pressurizing pressure chamber 28.
申请公布号 JP2001205557(A) 申请公布日期 2001.07.31
申请号 JP20000017309 申请日期 2000.01.26
申请人 FUJIKOSHI MACH CORP 发明人 NAKAMURA YOSHIO;DENDA YASUHIDE;ONISHI SUSUMU;HASHIZUME KENJI
分类号 B24B37/005;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/005
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