PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition for a printed-wiring board. SOLUTION: This photosensitive heat-curable resin composition comprises essentially (1) 100 pts.wt. of a polyfunctional cyanate ester compound or a prepolymer of the cyanate ester, (2) 0.005-5 pts.wt. of a heat-curing catalyst, and (3) 0.005-20 pts.wt. of a photoacid generating agent.