EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition used for sealing an optical semiconductor and excellent in clarity and resistance to soldering and to provide an optical semiconductor device sealed with a cured item of the composition. SOLUTION: The epoxy resin composition essentially comprises a reaction product of a phenolic compound having a specified structure and triglycidyl isocyanurate in a specified ratio, an acid anhydride curative, and a cure accelerator. The optical semiconductor device is prepared by sealing with a cured item of the composition.