| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for processing a substrate at an improved throughput and a method thereof. SOLUTION: The movement of a transfer unit 22 for transferring a wafer W, from a cooling unit to a resist liquid applying unit 3, is controlled by a transfer unit controller 26. A memory section 92 of the transfer unit controller 26 previously stores an application time required for applying a resist liquid and a transfer time required for transferring the wafer. When the start time of the application of the resist liquid is inputted, a control section 96 calculates the end time of the application of the resist liquid from the inputted start time and the stored application time. Furthermore, the control section 96 calculates the time it requires to take out the next wafer, to which the resist liquid is applied next, from the end time and the stored transfer time. The transfer unit controller 26 gives the transfer unit 22 a timing of taking out the wafer, based on the calculated time. |
