发明名称 SUBSTRATE-CONNECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate connecting device, which electrically connects substrates to each other or connects the substrate to a connection terminal, without requiring an excess space. SOLUTION: A substrate connecting device is formed, by laminating a plurality of connectors 21, 22 for connecting different electric substrates to each other on a single electric substrate (connector substrate) 10, and in the substrate connecting device, its structure has, for example, the electrical substrate 10, and a first connector 21 and a second connector 22 which are mounted on the electrical substrate 10, and the electrical substrates 10 are bent, and these two first and second connectors 21, 22 are overlapped and disposed, to form a lamination structure.
申请公布号 JP2001203431(A) 申请公布日期 2001.07.27
申请号 JP20000010722 申请日期 2000.01.19
申请人 OLYMPUS OPTICAL CO LTD 发明人 TAKANASHI TATSUO
分类号 H05K1/14;G03B17/02;(IPC1-7):H05K1/14 主分类号 H05K1/14
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