发明名称 |
ELECTRONIC CONNECTING PARTS |
摘要 |
PROBLEM TO BE SOLVED: To provide a connector or other connecting devices of electronic parts such as J/B good at restraining effect of leak current even under condition full of moisture. SOLUTION: The electronic connecting parts are composed of Ni plated layer and a terminal made of copper alloy plate with Sn plated layer formed on top of the Ni plated layer or a bus bar. Distance between positive and negative electrode terminal is set to 0.5 mm-5 mm, thickness of the Ni plating layer 0.05-2.0μm and the thickness of the Sn plating layer 0.3-5.0μm.
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申请公布号 |
JP2001203020(A) |
申请公布日期 |
2001.07.27 |
申请号 |
JP20000008789 |
申请日期 |
2000.01.18 |
申请人 |
KOBE STEEL LTD |
发明人 |
SHINTANI YASUHIRO;ISONO MASAAKI |
分类号 |
B60R16/02;B32B15/01;H01B5/02;H01R13/03;(IPC1-7):H01R13/03 |
主分类号 |
B60R16/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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