| 摘要 |
PURPOSE: An apparatus for attaching a solder ball on a BGA(Ball Grid Array) package is provided to reduce a manufacturing cost by using only one lower plate to control a location of a BGA package. CONSTITUTION: A solder ball is provided to an upper plate(12) through a metal mask(20). The metal mask(20) has a hole(18) at the same position as a solder ball(16) of a BGA package(10). The solder ball is loaded on the hole(18) of the metal mask(20). The remaining solder balls are removed through a groove(22) formed at one side of the upper plate(12). The upper plate(12) and a lower plate(14) are fixed by an insertion groove(24). The BGA package(10) is loaded on a fixing plate(26). The BGA package(10) is supported by a support plate(28). A fixing projection(30) is inserted into the insertion groove(24) to fix the upper plate(12) and the lower plate(14). A plurality of location control screw(32,33) controls a size and a location of the BGA package(10). A height control screw(34) controls a hight of the fixing plate(26).
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