| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer holding/protecting adhesive sheet capable of following the irregularities of wafer surfaces, even if there is a great difference of irregularities between the wafer surfaces. SOLUTION: The adhesive sheet is to be pasted to the surface of a semiconductor wafer, thereby holding/protecting the semiconductor wafer during processing of the wafer. The sheet comprises an intermediate layer (1) provided on one surface of a base material layer (3) and an adhesive layer (2) formed on the surface of the intermediate layer (1), and the intermediate layer (1) has a modulus of elasticity of 30-1000 kPa and a gel content of 20% or less.</p> |
