发明名称 |
LAMINATED CAPACITOR, WIRING BOARD, DECOUPLING CIRCUIT, AND HIGH-FREQUENCY CIRCUIT |
摘要 |
PROBLEM TO BE SOLVED: To provide a preferable mounting structure for a laminated capacitor having low ESL, when it is used as a decoupling capacitor to be connected to a power circuit for an MPU chip of an MPU. SOLUTION: A laminated capacitor 41 is stored in a cavity 66 formd in a wiring board 62. The laminated capacitor 41 is provided with a plurality of first external terminal electrodes 49, connected to first inner electrodes 44 via a plurality of first through conductors 46 and a plurality of second external terminal electrodes 41 connected to second inner electrodes 45 via a plurality of second through-conductors 47. The first external terminal electrodes 49 are installed on a first principal plane 48 of the body 43 of the capacitor to be connected to hot-side via hole conductors 70 for a power supply inside the wiring board 62, and the second external terminal electrodes 51 are installed on a second principal plane 50, to be ground-connected directly to a mother board 67. |
申请公布号 |
JP2001203125(A) |
申请公布日期 |
2001.07.27 |
申请号 |
JP20000008742 |
申请日期 |
2000.01.18 |
申请人 |
MURATA MFG CO LTD |
发明人 |
NAITO YASUYUKI;TANIGUCHI MASAAKI;KURODA TAKAKAZU;HORI HARUO;KONDO TAKANORI |
分类号 |
H05K1/16;H01G4/12;H01G4/30;H01L23/12;(IPC1-7):H01G4/30 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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