IMAGE PICKUP DEVICE, CAMERA MODULE, AND CAMERA SYSTEM

摘要

PROBLEM TO BE SOLVED: To solve such a problem that there is a limit in thinning when a conventional camera module structure is made. SOLUTION: This camera module 2 is equipped with a translucent substrate 10 which has a wiring pattern 13 formed on one surface and has an infrared-ray cutting function, an image pickup element 11 which has a light receiving part 15 and has the light receiving part 25 mounted by a flip-chip method on one surface of the translucent substrate 10 is a state to be opposite to an area where the wiring pattern 13 is not formed, and a lens unit 12 which is positioned on the light receiving part 15 of the image pickup element 11 and mounted on the other surface of the translucent substrate 10.