| 摘要 |
PROBLEM TO BE SOLVED: To improve the printability to a surface. SOLUTION: A common print layer 20 is preliminarily printed on the outside surface of a first sheet 12, and a circuit pattern 15 is formed on its inside surface. An IC chip 16 is mounted on the inside surface of the first sheet 12 through an anisotropic conductive adhesive 17 by flip chip mounting so that the bump 16a of the chip 16 may be connected to the circuit pattern 15. The peripheral part of the IC chip 16 is molded by soft sealing resin 18, and a reinforcing plate 19 is attached to the IC chip 16. At this time, a flash 19a of the reinforcing plate 19 is directed toward the first sheet 12. A second sheet 13 is joined to the inside surface of the first sheet 12 with an intermediate adhesive layer 14 between them to make a card. Thereafter, an arbitrary designed print layer 12 is printed on the outside surface of the second sheet 13. |
