发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with a MISFET and a manufacturing method for controlling a variation in characteristics by reducing a threshold voltage even when a gate electrode is made of metallic material. SOLUTION: The semiconductor device includes a semiconductor base layer containing a first conductive impurity, and a semiconductor layer 6 formed on the base layer 1 and having a groove. The semiconductor layer 6 has its bottom made of a surface of the base layer 1. The semiconductor device includes an insulating layer that covers the bottom face and the side wall of the groove, and a conductive layer 11 formed in the groove covered with the insulating layer 10. The semiconductor layer 6 has a second conductive impurity of conductivity type opposite to that of the first conductive impurity. The base layer 1 has an impurity diffusion layer 7 formed in a surface region and containing second conductive impurity with density lower than the semiconductor layer 6. In this case, a pattern formed by the semiconductor layer 6 including the groove and a pattern formed by the impurity diffusion layer 7 are the same.
申请公布号 JP2001203350(A) 申请公布日期 2001.07.27
申请号 JP20000012107 申请日期 2000.01.20
申请人 TOSHIBA CORP 发明人 AKASAKA YASUSHI;TANIMOTO KAZUMI
分类号 H01L21/336;H01L29/423;H01L29/43;H01L29/49;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L21/336
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