METHOD FOR MOULDING A FLAT ELECTRONICS MODULE ONTO THE BODY OF A PLASTIC CARD BY MEANS OF THERMOPLASTIC INJECTION MOULDING

摘要

The module (1) is injected onto the middle of the body (2) of the plastic card, whereby the upper half (3) of the first mould (3,4) used during the first shot is shaped in such a way that the relief of the module (1) on the upper side that is to be covered and which remains initially free of injected material lies in a fully flat position on the upper half (3) of the mould without any gap therebetween, while the lower side of the module (1) is squeezed out and the lower half of the mould (6) used in the second shot lies in a flat position on the areas (7) of the body of the card that were injected during the first shot.