| 摘要 |
PURPOSE: A semiconductor substrate and a method for manufacturing the same are provided to suppress the adhesion of particle and easily perform marking process. CONSTITUTION: In the semiconductor substrate having a semiconductor layer which is provided on the upper side with an insulation layer interposed, a mark(4) is formed in an area other than the surface area of the semiconductor layer. Specifically, a first substrate is prepared, and a mark is formed in the peripheral part of a second substrate, and then the first and second substrates are adhered with each other in such a manner that the marked parts are not adhered, and the unnecessary part of the first substrate is removed, thereby moving a moving layer of the first substrate to form an SOI substrate. |
