| 摘要 |
PROBLEM TO BE SOLVED: To provide a gold-tin electroplating bath, by which, even in the case of a large semiconductor substrate such as a 4 inch-wafer, a gold-tin alloy plating film small in the variation of the alloy composition can be obtained on the substrate. SOLUTION: This gold-tin alloy electroplating bath contains (a) soluble metal complex salt, (b) soluble bivalent tin salt, (c) at least one kind selected from hydroxycarboxylic acid and the salt thereof, (d) an organic phosphoric compound and (e) a hydroxybenzene compound.
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