| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching agent by which the problems of the stability of the liquid composition and odors are solved, and also, the etching rate of 0.1μm/min or more can be exhibited and moreover to provide an etching agent by which corrosiveness is extremely low even the etching agent remains on the surface in the case the etching agent is used for microetching, and moreover, roughened surface can be formed. SOLUTION: This etching agent for copper or a copper alloy is composed of an aqueous solution containing alkanolamine of 5 to 50 wt.%, a copper ion source of 0.2 to 10 wt.% as metallic copper, a halogen ion source of 0.005 to 10 wt.% as halogen and an aliphatic carboxylic acid of 0.1 to 15 wt.%, and in which the ratio of alkanolamine to 1 mol of aliphatic carboxylic acid is 2 mol or more.
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