发明名称 Integrated circuit having double bottom anti-reflective coating layer
摘要 A fabrication method reduces the amount of discoloration on interlevel dielectric layers due to anti-reflective coatings (ARC). The invention utilizes a barrier layer, such as, silicon nitride (SiN) that prevents the anti-reflective coating from contacting the interlevel dielectric layer (ILD0). The anti-reflective coating can be silicon oxynitride (SiON) deposited by LPCVD or PECVD.
申请公布号 US6265294(B1) 申请公布日期 2001.07.24
申请号 US19990373084 申请日期 1999.08.12
申请人 ADVANCED MICRO DEVICES, INC. 发明人 PARK STEPHEN KEETAI;MORALES GUARIONEX;RANGARAJAN BHARATH;SHIELDS JEFF
分类号 H01L21/027;H01L21/311;H01L21/314;H01L21/768;H01L23/532;(IPC1-7):H01L21/425;H01L21/76;H01L21/476;H01L21/461;H01L21/31 主分类号 H01L21/027
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