发明名称 |
Rework and underfill nozzle for electronic components |
摘要 |
A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections.A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.
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申请公布号 |
US6264094(B1) |
申请公布日期 |
2001.07.24 |
申请号 |
US20000511036 |
申请日期 |
2000.02.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COX WILTON L.;POOLE JOSEPH D.;SLESINGER KRIS A. |
分类号 |
B23K1/018;H01L21/56;H01L21/60;H05K3/34;H05K13/04;(IPC1-7):B23K31/00;B23K31/02;B23K1/19;B23K20/16 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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