| 摘要 |
Disclosed is a method for producing semiconductor devices by using a lithography technique. Process control marks, which are necessary for overlay exposure and so on, are formed, prior to formation of bonding pads, in a photolithography step on bonding pad areas intended to be finally used as continuity areas for deriving external wiring or on areas in the vicinity thereof. The process control marks are formed on the bonding pad areas having a much broader superficial content than scribe line areas. Therefore, even if the number of process control marks to be used increases, or if the marks themselves become large, all of the marks can be formed without using the scribe line areas.
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