发明名称 |
POLISHING DEVICE AND POLISHING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method suitable for flattening the surface of the work to be processed at a controlled temperature by a chemical and mechanical polishing(CMP) method. SOLUTION: A fluid pressure in a first passage 13 to supply the fluid 11 to a space 14 is kept bigger than a fluid pressure in a second passage 15 to discharge the fluid from the space 14 by using a polishing tool 100 having the space 14 formed so as to make contact with a polishing pad 1 through an elastic body 2 in a polishing pad holder 5. The flow of the fluid is produced in the space 14 and the fluid pressure in the space 14 is practically kept at a designated value by supplying the fluid to the space 14 and discharging it from the space 14. The polishing pad 1 is pressed onto a work by transmitting the fluid pressure in the space 14 to the polishing pad 1 through the elastic body 2, and the polishing pad 1 is moved relatively to the work while controlling the temperature of the fluid supplied to the space 14, in order to grind the work. |
申请公布号 |
JP2001198801(A) |
申请公布日期 |
2001.07.24 |
申请号 |
JP20000012931 |
申请日期 |
2000.01.21 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KAWA TOMOHIRO;KANESHIMA KEINOSUKE;SHINGU KATSUKI |
分类号 |
B24B37/005;B24B37/015;H01L21/304 |
主分类号 |
B24B37/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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