METHOD FOR DETECTING CHIP-OUT AND ENCAPSULANT OVERFLOW OF SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for detecting chip-out and encapsulant overflow of a semiconductor package is provided to detect selectively chip-out and encapsulant overflow in a semiconductor package manufacturing process. CONSTITUTION: A test camera(30) checks an external appearance of a semiconductor package(10) to determine a state of chip-out. A laser sensor(32) projects a laser beam to a bad portion of the chip. The laser sensor(32) measure a compared value by comparing a height of the bad portion with a height of a surface(24) of a normal chip. The chip is determined as chip-out if the height of the bad portion is lower than the height of the surface(24) of the normal chip. The encapsulant overflow is determined by referring to a tolerance limit of encapsulant overflow if the height of the bad portion is higher than the height of the surface of the normal chip.