| 发明名称 |
Device for dry etching a wafer and appertaining method |
| 摘要 |
The invention refers to a device and a method for dry etching a defined near-edge portion of a surface of a coated wafer (semiconductor disk).
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| 申请公布号 |
US2001008804(A1) |
申请公布日期 |
2001.07.19 |
| 申请号 |
US20010800172 |
申请日期 |
2001.03.06 |
| 申请人 |
SUMNITSCH FRANZ |
发明人 |
SUMNITSCH FRANZ |
| 分类号 |
H01L21/302;H01L21/00;H01L21/3065;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/302 |
| 代理机构 |
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