| 摘要 |
<p>An RF interconnect between an airline circuit including a dielectric substrate (60) having a conductor trace (62) formed on a first substrate surface and an RF circuit (80) separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure (86) having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure (88) surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the substrate and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the airline circuit.</p> |
