| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal base circuit board where the density of a control circuit is made high, and an electronic circuit module having satisfactory productivity. SOLUTION: In the metal base circuit board, a lead frame and a circuit board are arranged on one main face of a metal board via an insulating layer. In the electronic circuit module, electronic components are mounted on the lead frame of the metal base circuit board and/or the circuit board and the electronic components are resin-sealed. In the manufacturing method of the electronic circuit module, the entire face on which the electronic parts of the metal board are mounted is transfer-molded. |
