| 发明名称 |
METHOD FOR MANUFACTURING LAMINATED TYPE ELECTRONIC COMPONENT |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method with a good yield for a laminated type electronic component that is mainly used in an electronic apparatus. SOLUTION: In the laminated type electronic component, a dielectric sheet 5 and circuit electrodes 7, 8, 9, and 10 are laminated and baked at the same time to form a dielectric block 6.
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| 申请公布号 |
JP2001196253(A) |
申请公布日期 |
2001.07.19 |
| 申请号 |
JP20000005525 |
申请日期 |
2000.01.14 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NAKAKUBO HIDEAKI;IWASAKI TOMOYUKI |
| 分类号 |
H01F41/04;H01F17/00;H03H7/075;(IPC1-7):H01F41/04 |
主分类号 |
H01F41/04 |
| 代理机构 |
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