Lead-free low melting solder with improved mechanical properties and articles bonded therewith,申请号EP19950307804-传众专利搜索

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发明名称	Lead-free low melting solder with improved mechanical properties and articles bonded therewith
摘要
申请公布号	EP0711629(B1)	申请公布日期	2001.07.18
申请号	EP19950307804	申请日期	1995.11.01
申请人	AT&T CORP.	发明人	CHEN, HO SOU;MCCORMACK, MARK T.;JIN, SUNGHO
分类号	B23K35/26;C22C13/02;(IPC1-7):B23K35/26	主分类号	B23K35/26
代理机构		代理人
主权项
地址

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