发明名称 |
Thermal type air flow sensor |
摘要 |
<p>A thermal type air flow rate sensor (1) is formed with at least a heating resistor (4a, 4b) and a temperature measuring resistor (5) on a semiconductor substrate (2) via an electric insulation film (12a), by forming the heating resistor (4a, 4b) and the temperature measuring resistor (5) with an impurity doped silicon (Si) semiconductor thin film (13), and by performing high concentration doping process so that an electric resistivity ( rho ) of the silicon (Si) semiconductor thin film (13) is less than or equal to 8 x 10<-4> OMEGA cm, with simplified fabrication process for formation of the silicon (Si) semiconductor thin film (13) at the same impurity concentration simultaneously in a lump at low cost. <IMAGE></p> |
申请公布号 |
EP1116939(A2) |
申请公布日期 |
2001.07.18 |
申请号 |
EP20010100125 |
申请日期 |
2001.01.12 |
申请人 |
HITACHI CAR ENGINEERING CO., LTD.;HITACHI, LTD. |
发明人 |
YAMADA, MASAMICHI;WATANABE, IZUMI;NAKADA, KEIICHI |
分类号 |
F02D35/00;G01P5/12;G01F1/68;G01F1/684;G01F1/692;G01F1/698;(IPC1-7):G01F1/684 |
主分类号 |
F02D35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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