发明名称 METHOD AND APPARATUS FOR PLATING ONE SIDE OF METAL MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a stripe plating method and a stripe plating apparatus which can completely shut off a plating solution leaking on a back side of a metal and reducing the cost by reducing the consumption of a masking tape. SOLUTION: The stripe-like masking tape 13 is stuck on one surface of a hoop-like metal 12, and side surfaces of the metal 12 are held between a pair of side plates 14, 14 via sealing members 14, 14 from both sides with the side having the masking tape 12 stuck thereon on the lower side. The plating solution is sprayed from a spray nozzle 16 on the surface of the metal 12 with the masking tape 12 stuck thereon.
申请公布号 JP2001192888(A) 申请公布日期 2001.07.17
申请号 JP19990373879 申请日期 1999.12.28
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 NAITO YASUAKI;HAMADA YOSHIAKI
分类号 H01L23/50;C25D5/02;C25D7/12;(IPC1-7):C25D5/02 主分类号 H01L23/50
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