| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a through-hole filling ink for flatly filling a through-hole which eliminates or minimizes the need for the subsequent grinding and has heat resistance and does not cause troubles such as peeling upon effecting solder ing ball connection or the like when an electrically conductive pattern is plated on the filled through-hole. SOLUTION: The through-hole filling ink which can be plated only by resin etching treatment comprises (A) 25-70 pts.wt. cyanic ester resin, (B) 30-75 pts.wt. epoxy resin which is liquid at room temperature, (C) 300-600 pts.wt., based on 100 pts.wt. resin, copper filler having an average particle diameter of 10-30μm, and (D) 300-700 pts.wt., based on 100 pts.wt. resin, at least one filler selected from a copper alloy, nickel, and a nickel alloy which have an average particle diameter of 1μm to less than 10μm.</p> |
