| 摘要 |
PURPOSE: A molding die of a semiconductor package is provided to prevent a chip-out phenomenon and a clogging phenomenon of a gate by improving a structure of a molding die. CONSTITUTION: A semiconductor package is loaded on an upper face of a lower mold(2). An upper mold(8,10) is elevated by a press(18). The upper mold(8,10) is contacted closely to an upper face of the semiconductor package loaded on the lower mold(2). The upper mold(8,10) has a cavity for receiving a synthetic resin. A gate and a runner are formed on the upper mold(8,10) in order to inject the synthetic resin to the cavity. A gate switching pin(20) is formed on the upper mold(8,10) in order to open and shut an outlet of the gate.
|
