| 摘要 |
<p>The material comprises a rigid dielectric substrate (1) that is fitted on at least one of its faces with a conductive metal coating that can be partially or selectively eliminated to form conductive tracks. Said metal coating is formed by an inner layer (2) made of an aluminum alloy and a copper outer layer (3). The aluminum alloy layer (2) is thicker than the copper layer (3) so that the metal coating as a whole has thermal and electrical properties similar to those of an equivalent thick copper layer with up to 2.5 times less density. Both the inner layer (2) and the outer layer (3) are obtained by electrolytic growth on the substrate (1).</p> |
