| 摘要 |
<p>The present invention is directed to a copper aluminosilicate glass having coefficients of thermal expansion (CTEs) of 20-82 x 10-7/°C (over a range of 25-500 °C) and softening points of 660-1000 °C. The glass is useful as a preformed sealing glass. For example, in a vacuum lamp, a solder glass preform ring (10) of the inventive copper aluminosilicate glass fits against a glass wall (11) and a glass bead sleeve (22). An electrode lead wire (24) passes through the glass sleeve (22). The preferred copper aluminosilicate glass has a composition, in weight percent, of: SiO2 35-68, Al2O3 3-25, B2O3 2-26, R2O 0-20, RO 1-30, CuO 2-33, F 0-4, MxOy 0-10, R2O is an alkali metal oxide selected from Li2O, Na2O, and K2O. RO is an alkaline earth metal oxide selected from CaO, MgO, ZnO, SrO, and BaO. MxOy is a transition metal oxide selected from Co2O3, TiO2, NiO, MnO2, and Fe2O3.</p> |
