| 摘要 |
PURPOSE: To provide a face-regulated electrolytic copper foil having extremely good properties, a method for producing it, and its use. CONSTITUTION: In the method for producing face-regulated electrolytic copper foil, electrolytic copper foil having a shiny face and a mat face in which the average surface roughness lies in the range of 2.5 to 10μm is subjected to mechanical polishing at least one time so as to control the average surface roughness of the mat face to 1.5 to 3.0μm, and, after that, the mechanically polished mat face is selectively subjected to chemical polishing so as to control the average surface roughness to 0.8 to 2.5μm. Moreover, the face-regulated electrolytic copper foil is produced by such method. PCB and multilayer laminated PCB use this face-regulated electrolytic copper foil. The mat face is subjected to the mechanical polishing and is next subjected to the chemical polishing, so that the face-regulated electrolytic copper foil having extremely good properties can be obtd., where PCB denotes an abbreviation of printed circuit board. |
