发明名称 |
METHODS AND APPARATUS FOR HOLDING AND POSITIONING SEMICONDUCTOR WORKPIECES DURING ELECTROPOLISHING AND/OR ELECTROPLATING OF THE WORKPIECES |
摘要 |
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.
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申请公布号 |
WO0033356(A3) |
申请公布日期 |
2001.07.12 |
申请号 |
WO1999US28106 |
申请日期 |
1999.11.24 |
申请人 |
ACM RESEARCH, INC;WANG, HUI;GUTMAN, FELIX;NUCH, VOHA |
发明人 |
WANG, HUI;GUTMAN, FELIX;NUCH, VOHA |
分类号 |
C25D7/12;C25D17/06;C25D17/08;C25D21/10;C25F7/00;H01L21/288;H01L21/3063;H01L21/321;H01L21/687;(IPC1-7):H01L21/00 |
主分类号 |
C25D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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