SUBSTITUTION TYPE ELECTROLESS GOLD PLATING SOLUTION AND ELECTROLESS GOLD PLATING METHOD

摘要

PURPOSE: To provide a means capable of reducing the reduction caused by a heat history of the shear strength of a solder member such as a solder ball as possible even in the case a thin film shaped gold alloy is directly deposited on the surface of nickel or a nickel alloy. CONSTITUTION: In a substitution type electroless gold plating solution applying electroless gold plating on the surface of nickel, the electroless gold plating solution is blended with tetraethylenepentamine as straight chain alkylamine, hydrazine hydrate as a reducing agent for nickel or a nickel alloy and gold potassium cyanide as a gold source.