| 摘要 |
PURPOSE: A stack-type semiconductor package is provided to improve heat radiation capacity of the package, by diversifying a heat radiation path while increasing a heat radiation area, and to minimize the height protruded to an upper part of a molding body by positioning a solder ball on the package. CONSTITUTION: A semiconductor chip(1) has a bonding pad. A plurality of leads(2a) are disposed in the periphery of the semiconductor chip, comprising a ball land(200) having a relatively broader width as compared with other portions in a lengthwise direction and a bonding part for an electrical connection with the bonding pad. A conductive connection member(3) electrically connects the bonding pad of the semiconductor chip with the bonding part of the lead. A molding body(4) encapsulates the entire structure except a lower surface of the semiconductor chip, the ball land of the lead and a lower surface(201) of the lead so that only the lower surface of the semiconductor chip, the ball land of the lead and the lower surface of the lead are exposed. |
