<p>PURPOSE: A semiconductor package is provided to improve a light receiving efficiency by forming a lens portion on a glass. CONSTITUTION: A multitude of input/output pad(2a) is formed on one side of a semiconductor chip(2). The semiconductor chip(2a) is adhered on a circuit board(10). A circuit pattern including a multitude of bond finger(12) is formed on an upper face of the circuit board(10). A circuit pattern including a multitude of land(13) is formed on a bottom face of the circuit board(10). A conductive via hole(14) connects the circuit pattern of the upper face with the circuit pattern of the bottom face. A conductive wire(20) connects electrically the input/output pad(2a) with the bond finger(12). A dam(30) is formed on the circuit board(10) corresponding to an outer circumference of the semiconductor chip(2). A glass(40) is adhered to an upper face of the dam(30). A lens portion(60) is adhered to an upper portion of the glass(40). A conductive ball(50) is formed on the land(13).</p>
