METHOD FOR FORMING ALIGNMENT MARK OF WAFER

摘要

PURPOSE: A method for forming an alignment mark of a wafer is provided to prevent errors in measuring alignment by minimizing contrast difference between alignment marks when the degree of flatness of a wafer surface is poor. CONSTITUTION: At first the first alignment mark(22) is formed on the wafer in a right square pattern(22a) and a rectangular stripe pattern(22b) which is far from a side of the right square pattern. Then, the first alignment mark is flattened. At last, the second alignment mark(23) is formed in the rectangular stripe pattern on a region far from the right square pattern and the first alignment mark in the stripe pattern to be far from the side of the first alignment mark with a constant distance.