发明名称 LOW-TEMPERATURE-HARDENING-TYPE ANISTROPIC CONDUCTIVE CONNECTION MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an anistropic conductive connection material that can be hardened under a low temperature, can reduce contraction due to hardening to prevent accumulation of internal stress, can thus increase adhesive strength to improve conduction reliability, can enhance insulation property, and can maintain these characteristics for a long time. SOLUTION: This material is anistropically conductive connection material that has an adhesive to connect a member to be connected having opposed electrodes. The adhesive contains a cross linking-type radical polymeric resin component, a polymerization initiator, and an A-B type block copolymer having compatible segment and an incompatible segment with the radical polymeric resin component.
申请公布号 JP2001189108(A) 申请公布日期 2001.07.10
申请号 JP20000323319 申请日期 2000.10.18
申请人 SONY CHEM CORP 发明人 ISHIMATSU TOMOYUKI
分类号 C09J9/02;C09J201/00;H01B1/22;H01B1/24;(IPC1-7):H01B1/22 主分类号 C09J9/02
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