| 摘要 |
PROBLEM TO BE SOLVED: To adjust a needle card adjusting device for flattening, in relation to a wafer 8 to be contactedly formed with the needle set 6 of a needle card 1, connected with a substrate 3 which is used as a contact interface to an inspection head 5, more simply. SOLUTION: A needle card is connected with a substrate 3 via adjusting units 4 and 11, which are actuated separately and dynamically.
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