| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low-cost printed substrate and a method of mounting an electric component thereon which can enhance transfer speed of a signal pattern and reduce noise while maintaining high density in electric component mounting and in conductive pattern design. SOLUTION: A pad 2 for mounting component is formed by a conductive pattern on each of two positions on a surface of a printed substrate 1, and a through hole 3 for interlayer connection is bored inside each of the pads 2 for mounting component. In the manufacturing of the substrate, the through hole 3 is filled with a resist ink 4 from the opposite side of the component mounting plane. As a result, a confirmed air layer is formed inside the through hole 3 in the pasting process of solder 6, and influx of solder 6 into the through hole 3 is prevented.</p> |
