| 摘要 |
PURPOSE: A wafer level package is provided to strengthen an adhesion of a solder ball by using an interconnection medium, in which a support structure is reinforced, instead of a metal pattern. CONSTITUTION: A bond pad(11) and a ball land(12) are formed on one surface of a semiconductor chip. An insulation layer(20) such as polyimide is formed on the one surface of the semiconductor chip, and a pad exposing groove and a ball land exposing groove are formed in the insulation layer. The exposing grooves are connected through a trace route. The bond pad(11) and the ball land(12) are electrically connected by a metal wire(30) passing through the trace route. A solder ball(40) is mounted on the ball land, and the solder ball is mounted on the ball land together with the metal wire.
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