| 摘要 |
PURPOSE: A semiconductor chip, an electronic element, an electronic package and a forming method for the same are provided to reduce the stress concentrations produced within semiconductor chip packages, for example, at the outer edges of the chip-cap interface, within the adhesive material and the like. CONSTITUTION: A carrier is connected to a card or substrate by a plurality of connectors. The carrier includes an opening to house a semiconductor chip. The chip is electrically connected to the carrier by a plurality of connectors. A cover plate is mounted on the carrier and the chip by an adhesive. Unfortunately, due to differences in the coefficients of thermal expansion between the chip, the cover plate and the adhesive, in conjunction with thermal cycling, etc., stress concentrations occur within the chip as a result of geometric changes that take place within the chip package.
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