CHIP CARD FOR PREVENTING DELAMINATION OF CIRCUIT BOARD

摘要

PURPOSE: A chip card for preventing delamination of a circuit board is provided to prevent a delamination phenomenon from a boundary between a molding resin of a circuit board and a base card. CONSTITUTION: A circuit board(120) has an upper face for mounting a semiconductor chip(110) and a lower face as a contact surface(124). The semiconductor chip(110) mounted on an upper side of the circuit board(120) is molded by a molding resin(130). A base card(140) has a cavity(150) for loading the circuit board(120) molded by the molding resin(130). The cavity(150) is formed with an adhering portion(152) combined with the molding resin(130) of the circuit board(120) and a receiving portion(154) combined with the circuit board(120). A concavo-convex portion(160) is formed at a boundary portion between the adhering portion(152) of the base card(140) and the molding resin(130).