SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURING METHOD, AND OPTICAL PICK-UP USING IT

摘要

PURPOSE: A semiconductor laser device is provided to allow a conductive die bond paste not to stop up a main projection side light emitting point or a monitor side light emitting point and to remove a bad influence by return light of an optical pick up. CONSTITUTION: The semiconductor laser device comprises a semiconductor laser chip(10) arranged to push out an edge face of a main light emission side light emission point(16) of the semiconductor laser chip(10) from a header part(11a) at one end of a stem(11) or an edge face at one end of a sub-mound arranged on the stem. Conductive die bond paste(14) is used for die bonding of the semiconductor laser chip(10). A chamfering processing part(12a) or a corner curved surface processing part(12b) is arranged in the header part(11a) at one end of the stem(11) or a header part at one end of a sub-mound arranged on the stem(11). An optical pick-up is constituted of at least the semiconductor laser device, a diffraction lattice, a photo detector, a condenser lens and an object lens.